| PART |
Description |
Maker |
| W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L00 |
Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
|
CREE POWER
|
| JEITAED-4701300-307 JEITAED-4701300-303 JEITAED-47 |
Packge in 8mm tape on 7 diameter reels Compatible with automatic placement equipment
Packge in 8mm tape on 7 diameter reels Compatible with automatic placement equipment
|
Lite-On Technology Corporation
Lite-On Technology Corp...
|
| 21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm 封装外形12,16蜇薄QFN3x3x0.8mm
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| 0643241039 |
2.80mm (.110), CMC CP Female Terminal, Tin plated, for Tab Dimensions 2.8mm x0.8mm , Wire Size 1mm2 - 2mm2
|
Molex Electronics Ltd.
|
| 0643241029 |
2.80mm (.110), CMC CP Female Terminal, Tin plated, for Tab Dimensions 2.8mm x0.8mm, Wire Size 2mm2 - 3mm
|
Molex Electronics Ltd.
|
| PE1001-7 |
Hermetic Seal Solder Contact With 0.009 Pin Diameter 0.068 Body Diameter And 0.031 Pin Lengthq
|
Pasternack Enterprises, Inc.
|
| PE1001-6 |
Hermetic Seal Solder Contact With 0.012 Pin Diameter, 0.076 Body Diameter And 0.041 Pin Length
|
Pasternack Enterprises, Inc.
|
| 0643241139 643241139 |
2.80mm (.110), CMC CP Female Terminal, Tin plated; Selective 1.27μm Gold inContact Area, for Tab Dimensions 2.8mm x 0.8mm , Wire Size 1mm2 to 2mm2
|
Molex Electronics Ltd.
|
| 0643241129 643241129 |
2.80mm (.110), CMC CP Female Terminal, Tin plated; Selective 1.27μm Gold inContact Area, for Tab Dimensions 2.8mm x 0.8mm , Wire Size 2mm2 to 3mm2
|
Molex Electronics Ltd.
|
| 0643241149 |
2.80mm (.110), CMC CP Female Terminal, Tin plated, Selective 1.27μm Gold inContact Area, for Tab Dimensions 2.8mm x 0.8mm , Wire Size 0.50mm2 to 1mm2
2.80mm (.110"), CMC CP Female Terminal, Tin plated, Selective 1.27渭m Gold inContact Area, for Tab Dimensions 2.8mm x 0.8mm , Wire Size 0.50mm虏 to 1mm虏
|
Molex Electronics Ltd.
|
|
